Skip to content 
High-Performance Conductive Copper Powder & Flakes
The Industry-Leading Silver Alternative for EMI Shielding, Conductive Inks, and Adhesives.
Key Applications
EMI/RFI Shielding
Protecting precision electronics from interference.
Conductive Adhesives
High-reliability fillers for ECAs and glues.
Electronic Inks
Optimized for screen and gravure printing.
Antistatic Coatings
Effective ESD protection for industrial surfaces.
Technical Advantages
- Excellent Oxidation Resistance: Treated with coating technology.
- Stable Conductivity: Maintains low resistivity even in high-humidity environments.
- Customizable PSD: Tailored D50 and morphology to fit your specific resin system.
- Cost Efficiency: Significant cost savings compared to silver and silver-coated flakes.
